Wire wedge bonder equipment market is anticipated to grow at a CAGR of 3.0% during the forecast period. One of the prominent factors that fueled the market growth is the increasing modifications and advances in the manufacturing processes, coupled with the rising production of electronic products across the globe, and the advent of new chip packaging are the factors that droves the market revenue growth during the forecast period. Wedge bonder equipment provides electrical interconnects between a device chip and package using thin aluminum or gold wires, and is used to interconnect a broad range of technologies in various power semiconductor packages for several end-use industries such as automotive, industrial, and aerospace, among others. For instance, in august 2021, QP Technologies announced it has installed two new Hesse Mechatronics ultrasonic wire bonders at its wholly owned 20,000-square-foot facility. Adding these systems to the line enables to better address customer requirements for a wider range of substrate and chip types within core markets, as well as for new markets such as compact battery modules used in mobile and automotive applications.
The global wire wedge bonder equipment market is segmented based on the material, shape, and end-user. Based on the material, the market is bifurcated into gold wire bonding, copper wire bonding, and aluminum wire bonding. Based on shape, the market is sub-segmented into ball bonding, wedge bonding, and flip-chip bonding. Based on end-user, the market is sub-divided into aerospace and defense, consumer electronics, automotive, healthcare, energy, telecommunications, and others.
Among the end-user, the automotive segment is expected to witness favorable growth in the global wire wedge bonder equipment market. The increasing demand for electric vehicles has created a need for better, more reliable interconnections that is able to handle extreme temperature ranges in addition to shock and vibration conditions over increasingly longer lifetimes. Moreover, the presence of key players in the market that adopt numerous strategies such as partnerships, expansion, and collaborations will further aid in the segment growth. In March 2021, Inseto along with Kulicke & Soffa Asterion has selected for integrating a large diameter wire/ribbon wedge bonder for use in the production of wide bandgap (WBG) semiconductor-based power modules and the assembly of battery packs. The Asterion plays a crucial role in two major electric vehicles (EV) projects in which CIL is extensively involved.
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Wire Wedge Bonder Equipment Market Segmentation
By Material
- Gold Wire Bonding
- Copper Wire Bonding
- Aluminum Wire Bonding
By Shape
- Ball Bonding
- Wedge Bonding
- Flip-Chip Bonding
By End-User
- Aerospace and Defense
- Consumer Electronics
- Automotive
- Healthcare
- Energy
- Telecommunications
- Others
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Regional Analysis
North America
- United States
- Canada
Europe
- UK
- Germany
- Spain
- France
- Italy
- Rest of Europe
Asia-Pacific
- India
- China
- Japan
- South Korea
- Rest of APAC
Rest of the World
Company Profiles
- Amkor Technology
- Toray Engineering Co. Ltd.
- DIAS Automation
- F&K delvotec Bondtechnik gmbh
- Hesse GmbH
- Hybond Inc.
- JCET Group Co., Ltd.
- Kulicke and Soffa Industries, Inc.
- NEO Tech.
- Palomar Technologies, Inc.
- Powertech Technology Inc.
- SHINKAWA Electric Co., Ltd.
- TPT Wire Bonder GmbH & Co. KG
- ULTRASONIC ENGINEERING Co., LTD.
- West·Bond Inc
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