The global wire wedge bonder equipment market is anticipated to grow at a CAGR of 3.0% during the forecast period. The prominent factor that is projected to drive the market demand is the increasing use of 3D chip packaging, coupled with the growing usage of semiconductors packaging equipment, and the rise in the launch of new products with innovative features compelling companies to modify manufacturing processes. For instance, in December 2020, Semiconlight announced it has signed a license agreement for flip chip technology with HC Semitek. Through this venture, Semiconlight will receive technology royalties related to LED flip chip IP and design among HC Semitek ‘s specific sales. This contract is the first technology royalty contract, and it is expected to help in the patent claim strategy related to flip-chip LED for China in the future. Adding on, in February 2021, Palomar Technologies, announced that Bay Photonics is working on projects that require the placement and bonding of flip-chip photonics devices that require the use of specialized equipment and are using a Palomar 3880 Die Bonder in the process. The Palomar 3880 die bonder recently purchased by EPIC Paignton is being utilized to ensure that the final layout of the photonic ICs (PICs) is suitable for the targeted assembly and packaging processes.
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In November 2020, Harvatek Corp. has introduced a new LED product in chip scale package (CSP). This LED has high brightness with low power dissipation and there is no wire bonding which reduces the processing time. CSP provides a wide viewing angle with great color uniformity that enables customers to be more customizable with LEDs, and the product’s specifications are tailored and changed to the customer’s content.
Market Coverage
- The market number available for – 2021-2028
- Base year- 2021
- Forecast period- 2021-2028
Segment Covered-
- By Material
- By Shape
- By End-User
Regions Covered-
- North America
- Europe
- Asia-Pacific
- Rest of the World
- Competitive Landscape includes- Amkor Technology, Toray Engineering Co. Ltd., Kulicke and Soffa Industries, Inc., NEO Tech., Palomar Technologies, Inc., and others.
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Wire Wedge Bonder Equipment Market– Segmentation
By Material
- Gold Wire Bonding
- Copper Wire Bonding
- Aluminum Wire Bonding
By Shape
- Ball Bonding
- Wedge Bonding
- Flip-Chip Bonding
By End-User
- Aerospace and Defense
- Consumer Electronics
- Automotive
- Healthcare
- Energy
- Telecommunications
- Others
Wire Wedge Bonder Equipment Market by Region
North America
- United States
- Canada
Europe
- UK
- Germany
- Spain
- France
- Italy
- Rest of Europe
Asia-Pacific
- India
- China
- Japan
- South Korea
- Rest of APAC
Rest of the World
- Latin America
- Middle East and Africa
Company Profiles
- Amkor Technology
- Toray Engineering Co. Ltd.
- DIAS Automation
- F&K delvotec Bondtechnik gmbh
- Hesse GmbH
- Hybond Inc.
- JCET Group Co., Ltd.
- Kulicke and Soffa Industries, Inc.
- NEO Tech.
- Palomar Technologies, Inc.
- Powertech Technology Inc.
- SHINKAWA Electric Co., Ltd.
- TPT Wire Bonder GmbH & Co. KG
- ULTRASONIC ENGINEERING Co., LTD.
- West·Bond Inc
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