The Wafer Level Packaging Market size is expected to grow at an annual average of 20% during 2021-2027. Wafer-level packaging (WLP) is used to interconnect electronic components such as resistors, capacitors, transistors, etc. on a single chip to create integrated circuits and utilize solder bumps deposited on chip pads. WLP allows wafer manufacturing, packaging, testing, and burn-in to be integrated at the wafer level to streamline the manufacturing process performed on the device.
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A full report of Wafer Level Packaging Market is available at: https://www.orionmarketreports.com/wafer-level-packaging-market/38723/
The following segmentation are covered in this report:
By Integration Type
- Fan-in WLP
- Fan-out WLP
By Industry
- Electronics
- IT & Telecommunication
- Industrial
- Automotive
- Aerospace & Defense
- Healthcare
- Others (Media & Entertainment and Non-Conventional Energy Resources)
By Bumping Technology
- Copper Pillar
- Solder Bumping
- Gold Bumping
- Others (Aluminum & Conductive Polymer Bumping)
Company Profile
- Amkor Technology
- Applied Materials, Inc.
- Brewer Science, Inc.
- Deca Technologies
- Fujitsu
- Infineon Technologies AG
- LAM RESEARCH CORPORATION
- Siliconware Precision Industries Co., Ltd.
- STATS ChipPAC Ltd
- Tokyo Electron Limited
The report covers the following objectives:
- Proliferation and maturation of trade in the global Wafer Level Packaging Market
- The market share of the global Wafer Level Packaging Market supply and demand ratio, growth revenue, supply chain analysis, and business overview.
- Current and future market trends that are influencing the growth opportunities and growth rate of the Wafer Level Packaging Market
- Feasibility study, new market insights, company profiles, investment return, revenue (value), and consumption (volume) of the global Wafer Level Packaging Market
(This release has been published on OMR Industry Journal. OMR Industry Journal is not responsible for any content included in this release.)
