The Thin-Film Encapsulation (TFE) market was valued at $45.2 million in 2019 and is expected to reach $2159 million by 2027 and is expected to grow at a CAGR of 25% from 2021 to 2027. The trend of thin film encapsulation using inkjet printing, the rapid adoption of flexible OLED displays for smart phones and smart wearables greatly drives the market growth, while the development of flexible glass plays a major deterrent to the market growth.
A full report of Thin-Film Encapsulation (TFE) Market available at https://www.orionmarketreports.com/thin-film-encapsulation-market/8579/
Major Market Players
• Samsung SDI (Novaled) (South Korea)
• LG Chem (South Korea)
• Universal Display Corp. (UDC) (US)
• Applied Materials (US)
• 3M (US)
• Veeco Instruments (US)
• Kateeva (US)
• Toray Industries (Japan)
• BASF (Rolic) (Germany)
• Meyer Burger (Switzerland)
• Aixtron (Germany)
• Bystronic Glass (Germany)
• AMS Technologies (Germany)
• Angstrom Engineering (Canada)
Thin-Film Encapsulation (TFE) Market Segmentations
By Product
• Copper Cables
• Fiber Optic Cables
By Application
• LAN
• Data Center
By Vertical
• Government
• Industrial
• IT & Telecommunications
• Residential & Commercial
• Others
(This release has been published on OMR Industry Journal. OMR Industry Journal is not responsible for any content included in this release.)
