Tag Archives: Wafer Level Packaging Market

Wafer Level Packaging Market Share 2021: Global Trends, Key Players, Industry Analysis Report to 2027

The Wafer Level Packaging Market size is expected to grow at an annual average of 20% during 2021-2027. Wafer-level packaging (WLP) is used to interconnect electronic components such as resistors, capacitors, transistors, etc. on a single chip to create integrated circuits and utilize solder bumps deposited on chip pads. WLP allows wafer manufacturing, packaging, testing, […]