Through-Glass Via (TGV) technology provide vertical electrical connections through the glass substrate. Useful for advanced packaging solutions such as glass interposers and wafer-level packaging for micro-electro-mechanical systems (MEMS).It offers high structural integrity, good resistance to vibration and temperature, environmental robustness and low electrical losses. Company Profile Corning LPKF Samtec Kiso Micro Co.LTD Tecnisco Microplex […]
