The System in Package (SIP) market is expected to witness market growth at a rate of 9% during the forecast period from 2021 to 2027.
The growth of the SIP (System in Package) market can be reinforced with the increasing demand for miniaturization of electronic devices, technological advancements in line with the increase in research and development activities, and the spread of technologies that provide high-performance and low-power consumption solutions. Forecast period for 2020-2027. On the other hand, the advent of 5G technology and the increasing use of high-bandwidth RF components will further bring a variety of opportunities for the growth of the System In Package (SIP) market in the forecast period mentioned above.
A full report of System in Package Market available at https://www.orionmarketreports.com/system-in-package-market/40764/
Company Profiles
• Amkor Technology, Inc.
• ASE Technology Holding Co. Ltd
• ChipMOS TECHNOLOGIES INC
• GS Nanotech
• JCET Group Co., Ltd.
• QUALCOMM INCORPORATED
• Samsung
• Renesas Electronics Corporation
• Texas Instruments Incorporated
• Taiwan Semiconductor Manufacturing Company, Limited
System in Package Market- Segmentation
By Packaging Technology
• 2D IC
• 2.5D IC
• 3D IC
By Package Type
• Ball Grid Array
• Surface Mount Package
• Pin Grid Array
• Flat Package
• Small Outline Package
By Packaging Method
• Fan-Out Wafer Level Packaging
• Wire Bond & Die Attach
• Flip Chip
By Application
• Automotive & Transportation
• Consumer Electronics
• Communication
• Industrial
• Aerospace & Defense
• Healthcare
• Emerging & Others
By Device
• RF Front-End
• RF Power Amplifier
• Power Management Integrated Circuits
• Baseband Processor
• Application Processor
• Microelectromechanical System
• Others
(This release has been published on OMR Industry Journal. OMR Industry Journal is not responsible for any content included in this release.)
