Semiconductor wafer polishing and grinding equipment market is anticipated to grow at a CAGR of 10.2% during the forecast period (2025-2035). Pivotal factors such as rising industrial sectors for consumer electronics, telecom, and auto, and increasing production of more compact stronger, and less energy-consuming semiconductors demand ultra-thin and faultless wafers. Further, the expansion and deployment of 5G communications and expansion and proliferation of the Internet of Things (IoT) with greater performing semiconductors and emerging advanced package structures such as 3D-ICs, and system-in-package SiP, among others also contribute to industry growth.
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One of the trends in the market for semiconductor wafer polishing and grinding equipment is increased demand for advanced chemical mechanical planarization (CMP) equipment. The complexity of the semiconductor device increases, and manufacturers are looking for highly precise and efficient polishing solutions to achieve the required uniformity of the wafer surface. CMP equipment is evolving to meet the stringent requirements of advanced node technologies, thereby enabling the production of smaller, faster, and more energy-efficient chips. In addition, growth in the adoption of 3D NAND and FinFET architecture technologies has fuelled the necessity of developing a range of more specific CMPs suited to meet such complex designs. Companies continue investing heavily in R&D programs, focusing on optimizing equipment performance and lowering defect rates with high production yield improvements. It’s a function of the necessity of pushing more performing chips into applications, such as AI, 5G, or autonomous vehicle applications.
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- Market Coverage
- Market number available for – 2025-2031
- Base year- 2025
- Forecast period- 2025-2031
- Segment Covered- By Source, By Product Type, By Applications
- Competitive Landscape- Archer Daniels Midland Co., Ingredion Inc., Kerry Group Plc, Cargill
- , and others
Global Semiconductor Wafer Polishing and Grinding Equipment Market Report Segment
By Type
- Semiconductor Wafer Polishing Equipment
- Semiconductor Wafer Grinding Equipment
By End-user
- Foundries
- Memory Manufacturer
- Integrated Device Manufacturers (IDMs)
- Others (Testing and Packaging Service Providers)
Global Semiconductor Wafer Polishing and Grinding Equipment Market Report Segment by Region
North America
- United States
- Canada
Europe
- UK
- Germany
- Italy
- Spain
- France
- Russia
- Rest of Europe
Asia-Pacific
- China
- India
- Japan
- South Korea
- Australia and New Zealand
- ASEAN Economies
- Rest of Asia-Pacific
Rest of the World
- Latin America
- Middle East & Africa
The Report Covers
- Market value data analysis of 2024 and forecast to 2035.
- Annualized market revenues ($ million) for each market segment.
- Country-wise analysis of major geographical regions.
- Key companies operating in the global semiconductor wafer polishing and grinding equipment market. Based on the availability of data, information related to new products, and relevant news is also available in the report.
- Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.
- Analysis of market-entry and market expansion strategies.
- Competitive strategies by identifying ‘who-stands-where’ in the market.
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