The semiconductor and IC packaging materials market has grown significantly due to factors such as increasing demand for consumer electronics. In addition, the increased awareness of the implementation of electronic packaging materials opens up huge market opportunities for major players operating in the semiconductor and IC packaging materials markets. However, fluctuations in raw material prices, which are considered a major component, are expected to hinder the overall growth of the semiconductor and IC packaging materials market.
A full report of Semiconductor And IC Packaging Material Market available at: https://www.orionmarketreports.com/semiconductor-and-ic-packaging-materials-market/24939/
Semiconductor And IC Packaging Material Market- Segmentation
By Type:
• Organic substrates
• Bonding wires
• Leadframes
• Encapsulation resins
• Ceramic packages
• Die attach materials
• Thermal interface materials
• Solder balls
• Others
By Packaging Technology:
• SOP
• GA
• QFN
• DFN
• QFP
• DIP
• Others
Key Market Players
• Alent Plc
• BASF SE
• Henkel Ag and Company
• Hitachi Chemical Co. Ltd.
• Kyocera Chemical Co. Ltd.
• LG Chemical Ltd.
• Mitsui High-Tec Inc.
• Sumitomo Chemical Co. Ltd.
• Tanaka Holdings Co., Ltd.
• Toray Industries Corporation
(This release has been published on OMR Industry Journal. OMR Industry Journal is not responsible for any content included in this release.)
