Global silicon capacitors market is anticipated to grow at a CAGR of 5.8% during the forecast period (2024-2031). The market growth is driven by the rising demand for silicon capacitors from the electronic & electrical sector for high-speed digital circuit designing owing to their superior operating frequency range, long-term stability, and temperature range. Silicon capacitors have applications in various sectors such as medical, telecom, industry, and more. In the medical sector, capacitors are used in implantable medical devices such as defibrillators, insulin pumps, and pacemakers, and portable & wearable devices (including electrocardiograms, ultrasonic echo devices, and blood gas analyzers). In the telecom sector, silicon capacitor is used for powering Integrated Circuits (ICs). However, the low capacitance range and high charge leakage in silicon capacitors are restraining the market growth during the forecast period.

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The global silicon capacitors market is segmented by type (deep-trench capacitor, MNOS capacitor, and MIS capacitor) by application (automotive, telecommunication, electronic & electrical, healthcare, aerospace and defense, and others), and by geographies (North America, Europe, Asia-Pacific, and Rest of the World).

The major players in the global silicon capacitors market include Arrow Electronics, Inc., Murata Manufacturing Co., Ltd., MACOM Technologies, Microsemi Corp, Skyworks Solutions, Inc., Taiwan Semiconductor Manufacturing Co., and AVX Corp., among others. The market players are contributing significantly to the market growth, by the adoption of various business strategies, such as collaborations, mergers and acquisitions, product portfolio diversification, and more.

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Recent Developments

• In November 2023, ROHM Co., Ltd. developed new silicon capacitors – the BTD1RVFL series. The devices were adopted for smartphones and wearable devices. The capacitors are manufactured using proprietary RASMID™ miniaturization technology and process 1µm increments that eliminate chipping during external formation and improve dimensional tolerances within ±10µm. The small variation in product size enables mounting with a narrower distance between adjacent components. The backside electrode used for bonding to the substrate has been upgraded to the periphery of the package to improve mounting strength.
• In March 2023, Murata Manufacturing Co., Ltd. expanded its silicon capacitor manufacturing by creating a new 200-mm mass production line in Caen, France. The facility is anticipated to create more than 100 new jobs in 2023–2025. The capacitors provide for various applications including implantable medical systems, telecommunication infrastructures, and mobile phones. The new line features 200 mm wafers, focusing on the PIC’s latest technology. The products will primarily target the mobile handset market with very high performances and capacitance values in super small sizes with thicknesses as low as 40 µm.
• In June 2021, Murata Manufacturing Co., Ltd., extended its product offering for the mobile and high-performance computing (HPC) markets with the availability of its silicon process technology to fabricate silicon capacitors with a density of 1.3µF/mm². The product features extremely low ESL (few pH) and low ESR (few mΩ) to support the highest performances of new power distribution networks (PDN) that require low impedance over a wide frequency bandwidth. It offers a 40µm profile that enables chip designer engineers to embed the silicon capacitor into the package as close to the active die as possible, minimizing the current’s effective path length and, thereby, minimizing parasitics.

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