The Global Molded Interconnect Device Market size is expected to grow at an annual average of 14.3% during 2019-2025. Molded interconnect devices are three-dimensional electromechanical parts. In addition, these devices are key components for a variety of mechanical and electrical engineering applications used in the automotive and communications industries. Molded interconnects can minimize the number of parts in a circuit, shorten assembly time, are cost effective for complex electromechanical functions, and are expected to increase the use of MID dies in a variety of end-use applications.
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The following players are covered in this report:
By Process
- Laser direct structuring
- 2-shot molding
- Film technique
By Product Type
- Antenna and connection module
- Connectors and switches
- sensor
- light
- Etc
By Industry
- Communication
- Home Appliances
- Medical treatment
- car
(This release has been published on OMR Industry Journal. OMR Industry Journal is not responsible for any content included in this release.)
