The global molded interconnect device market is anticipated to grow at a significant CAGR of 13% during the forecast period. The increasing demand for compact features in electronics devices and adoption of MID to reduce the circuit density are the factors that has positively influenced the market growth. The growing use of molded interconnect devices in medical & healthcare industry is gaining popularity. The medical industry is integrating and adopting new technology to deliver better services to patients. Medical devices have employed MID technology to improve product quality and to reduce failure ratio and complexities. MID is used in a variety of portable devices, including glucose metres, blood pressure monitors, heart rate monitors, pulse oximeters and hearing aids. In these diagnostics devices, the molded interconnect device technology aids in achieving low power consumption, excellent precision, and a small footprint. MID aids in the miniaturisation of medication monitoring devices, which increases their diagnostic capabilities.
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In the coming years, increasing innovations and R&D in the medical technology sector will promote the implementation of innovative medical equipment. Over the projected period, this is expected to provide new growth opportunities for MID manufacturers. Apart from these, high cost of MID due to cost of raw material such as high-performance thermoplastics, polycarbonates used in MID manufacturing can restrain the market growth.
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- Market Coverage
- Market number available for – 2022-2028
- Base year- 2021
- Forecast period- 2022-2028
- Segment Covered- By Source, By Product Type, By Applications
- Competitive Landscape- Archer Daniels Midland Co., Ingredion Inc., Kerry Group Plc, Cargill
- , and others
Market Segmentation
Global Molded Interconnect Device Market by Process
- Laser Direct Structuring
- Two – Shot Molding
- Film Technique
Global Molded Interconnect Device Market by Product Type
- Antennae and Connectivity Modules
- Connector and Switches
- Sensors
- Lighting
Global Molded Interconnect Device Market by Industry
- Medical
- Automotive
- Consumer Electronics
- Telecommunication
- Aerospace and Defence
Regional Analysis
- North America
- US
- Canada
- Europe
- UK
- Germany
- Italy
- Spain
- France
- Rest of Europe
- Asia-Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
- Rest of the World
Company Profiles
- 2E Mechatronic
- Amphenol Corp
- Cicor Group
- DuPont de Nemours, Inc.
- Ensinger India Engineering Plastics Pvt. Ltd.
- Evonik Industries AG
- Fujitsu Ltd.
- Harting Technology Group
- JOHNAN Corp.
- LANXESS
- LPKF Laser & Electronics AG
- I.D Solutions Pty. Ltd.
- Molex LLC
- Multiple Dimensions AG
- RTP Co
- RTP Company
- SelectConnect Technologies
- SINOPLAST GROUP LTD.
- TE Connectivity Corp.
- TEPROSA GmbH
- THALES
- Zeon Corp.
The Report Covers
- Market value data analysis of 2021 and forecast to 2028.
- Annualized market revenues ($ million) for each market segment.
- Country-wise analysis of major geographical regions.
- Key companies operating in the global molded interconnect device market. Based on the availability of data, information related to new product launches, and relevant news is also available in the report.
- Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.
- Analysis of market-entry and market expansion strategies.
- Competitive strategies by identifying ‘who-stands-where’ in the market.
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