The Global Liquid Encapsulation Materials Market size is expected to grow at an annual average of 5.3% during 2019-2025. Liquid encapsulation protects the various technologies incorporated inside the device. Liquid encapsulation is widely used in discrete sensors, integrated circuits and products with optoelectronics. The growing demand for a variety of advanced packaging technologies and the growing demand for consumer electronics are key factors driving the liquid encapsulation material market.
The following players are covered in this report:
By Application:
- Automotive
- Industrial
- Telecommunication
- Electronics
By Product:
- Integrated Circuits
- Optoelectronics
- Discrete Semiconductors
- Sensors
By Material:
- Epoxy Resins
- Epoxy-Modified Resins
- Other
(This release has been published on OMR Industry Journal. OMR Industry Journal is not responsible for any content included in this release.)
