Interposer Fan Out Wlp Market 2019 Growth, COVID Impact, Trends Analysis Report 2025

The Global Interposer Fan Out Wlp Market size is expected to grow at an annual average of 26.3% during 2019-2025. An interposer is basically an electrical interface whose purpose is to reroute a connection to another connection. FOWLP (Fan-out WLP) is an advanced version of the standard wafer level package and is a technology developed to meet the demand for a higher level of integration and a larger number of external contacts by electrical devices.

The following players are covered in this report:

By Packaging Technology:

  • Through-silicon vias (TSVs)
  • Interposers
  • Fan-out wafer-level packaging (FOWLP)

By Application:  

  • Logic
  • Memory
  • MEMS/sensors
  • LED

By End-User Industry:

  • Consumer electronics
  • Telecommunication
  • Industrial sector

Automotive

(This release has been published on OMR Industry Journal. OMR Industry Journal is not responsible for any content included in this release.)