The Global High Density Interconnect Market size is expected to grow at an annual average of 11.3% during 2021-2027. High Density Interconnect (HDI) is a technology that allows PCBs to be constructed much more densely with the ability to place much smaller components closer together, resulting in shorter paths between components. HDI is more than just miniaturization of PCB designs. HDI helps reduce size and weight and improves the electrical performance of the device.
A full report of Global High Density Interconnect Market is available at: https://www.orionmarketreports.com/high-density-interconnect-market/45245/
The following players are covered in this report:
By End User
- Automotive
- Consumer Electronics
- Telecommunications
- Medical
- Others
By Application
- Automotive Electronics
- Computer and Display
- Communication Devices and Equipment
- Audio/Audiovisual (AV) Devices
- Connected Devices
- Wearable Devices
- Others
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