The Extreme Ultraviolet Lithography Market size is expected to grow at an annual average of 7% during 2021-2027. Extreme Ultraviolet Lithography market is projected to grow at a significant CAGR during the forecast period.EUV lithography makes use of light with a wavelength of just 13.5 nm, which is a decrease of almost 14 times the wavelength of other advanced chipmaking lithography methods, Deep Ultraviolet lithography, which uses 193 nm of light. ASML, which is the dominant player on the market, has been finding ways to reduce transistor sizes and has made substantial progress in the field of EUV lithography, enabling more accurate and effective development of small transistor semiconductors with a node size of around 7nm or even 5nm.
Extreme UV lithography is a next-generation lithography technique that uses the smallest wavelength to build circuits with small features and achieve better resolution performance. Lithography is used to print complex patterns that characterise integrated circuits on semiconductor wafers. EUV lithography (EUVL) is one of the leading lithography (NGL) technologies of the next decade. Discharge-produced plasma (DPP) and laser-produced plasma (LPP) are the leading technologies used to generate high-powered EUV radiation.
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A full report of Extreme Ultraviolet Lithography Market is available at: https://www.orionmarketreports.com/extreme-ultraviolet-lithography-market/45025/
The following segmentation are covered in this report:
By Light Source
- Laser Produced Plasmas (LPP)
- Vacuum Sparks
- Gas Discharges
By Equipment
- Light Source
- Mirrors
- Mask
- Others
By Application
- Memory
- IDM
- Foundry
- Others
Company Profile
- ASML Holding NV
- NTT Advanced Technology Corporation
- Canon Inc.
- Nikon Corporation
- Intel Corporation
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