The global electronic adhesives market is anticipated to grow at a CAGR of 6.5% during the forecast period. Electronic adhesives are mainly used in surface mounting, offering conformal coating, heat sinks, electric motor applications, and others which are replaced by many traditional soldering systems. Thus, widely-being used by the automobile sector as they required lighter weight and more compact solutions to gain additional energy density.
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According to the Indian Brand Equity Foundation, India’s annual production of automobiles in FY22 was 22.93 million vehicles which is increasing due to a rise in the middle-class income. Adding to the rising in the demand for the automobile sector increases the demand for electronic adhesives. To provide the adhesive solution to the automobile manufacturing industry, electronic adhesives market players are launching products to meet the manufacturer’s demand. For instance, in January 2022, Parker Lord, a division of Parker Hannifin Corp., which provides engineering solutions for aerospace, automobile, and other industry expanded its product portfolio for electric vehicle manufacturers by including new thermally conductive (TC) adhesives and one-component (1K) low-density gap fillers to support its product offering of thermal management encapsulants, adhesives, and gap fillers. The product is designed to provide a lightweight solution at an affordable price to the automobile manufacturing industry. Adding on the product offers strong adhesion, substantial thermal conductivity, low density, improved flow characteristics and low dielectric constant, which are required by the automobile manufacturing industry.
Moreover, in March 2022, Toyochem Co., Ltd., the polymers and coatings arm of Japan’s Toyo Ink Group, launched Oribain EXK 21-046, a low-odour, low-VOC acrylic pressure-sensitive adhesive (PSA). The product is specially designed for use in enclosed spaces such as vehicles and building interiors. Rising in the automobile industry will fuel the overall electronic adhesives market.
Market Coverage
- The market number available for – 2021-2028
- Base year- 2021
- Forecast period- 2022-2028
Segment Covered-
- By Form
- By Resin Type
- By Product Type
- By End-Users
Regions Covered-
- North America
- Europe
- Asia-Pacific
- Rest of the World
- Competitive Landscape- including The Dow Chemical Company, ThreeBond Holdings Inc., Shin-Etsu Chemical Co., Ltd., Showa Denko Materials Co., Ltd., Henkel Adhesives Technologies India Pvt Ltd., and others.
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Electronic Adhesives Market Report Segment
By Form
- Liquid
- Solid
- Paste
By Resin Type
- Epoxy
- Silicone
- Acrylic
- Polyurethane (PU)
By Product Type
- Electrically Conductive Adhesives
- Thermally Conductive Adhesives
By End-Users
- Computers & Servers
- Telecommunications
- Consumer Electronics
- Industrial
- Medical
- Automotive
Electronic Adhesives Market Report Segment by Region
North America
- United States
- Canada
Europe
- UK
- Germany
- Spain
- France
- Italy
- Rest of Europe
Asia-Pacific
- India
- China
- Japan
- South Korea
- Rest of APAC
Rest of the World
- Latin America
- Middle East and Africa
Company Profiles
- Alent plc
- Arkema Group (BOSTIK S.A.)
- BASF SE
- Dymax Corp
- Evonik Industries AG
- B. Fuller Company
- Henkel Adhesives Technologies India Pvt. Ltd.
- KCI USA, Inc. (3M Medical Solutions (3M))
- Konishi Co, LTD.
- KYOCERA Chemical Corp.
- Parker Hannifin Corp.
- Shin-Etsu Chemical Co., Ltd.
- Showa Denko Materials Co., Ltd.
- Sika AG
- The Dow Chemical Co.
- ThreeBond Holdings Inc.
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