The global die bonder equipment market is expected to grow from USD 820 million in 2019 to USD 972 million with an annual growth rate of 3% through 2024. Key factors driving the growth of the Die Bonder Equipment market include increasing demand for small electronic components and increasing adoption of stackable die technology in IoT devices.
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A full report of Die Bonder Equipment Market available at: https://www.orionmarketreports.com/die-bonder-equipment-market/47227/
Die Bonder Equipment Market Segmentation
By Type
• Manual Die Bonders
• Semiautomatic Die Bonders
• Fully Automatic Die Bonders
By Bonding Technique
• Epoxy
• Eutectic
• Soft Solder
• Others
By Supply Chain Participant:
• OSAT Companies
• IDM Firms
By Device:
• Optoelectronics
• MEMS And MOEMS
• Power Devices
By Application:
• Consumer Electronics
• Automotive
• Industrial
• Telecommunications
• Healthcare
• Aerospace & Defense
(This release has been published on OMR Industry Journal. OMR Industry Journal is not responsible for any content included in this release.)
