The global copper wire bonding market is anticipated to grow at a significant CAGR during the forecast period. Copper wire bonding is a wire bonding procedure in semiconductor packaging that uses copper wire instead of aluminium or gold wires in standard semiconductor packaging. Copper wire bonding began to appear in low-cost consumer-grade in 2018, eventually replacing gold wire bonding due to lower cost optimization. The growing gold costs, as well as the rising adoption of copper wire bonding in the automotive and consumer electronics industries, are propelling the global copper wire bonding market.
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Copper wire bonding is also utilised in a variety of applications across many industry verticals, including healthcare, military and defence, consumer electronics, automotive, aviation, and a few others. This has resulted in growing demand from manufacturers, which is driving the global copper wire bonding market growth over the forecast period. Copper wire bonding is also used in harsh environment applications because of their superior electrical and thermal conductivity, which enhance performance.
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With rising market rivalry, both regional and global competitors are working on developing new items to maintain and strengthen their market position. To obtain an advantage over their competitors, major firms are focusing on merger and acquisition activity as well as technical development.For instance, In India, the government has initiated projects such as 100 smart cities and ‘Housing for All by 2022’ which are expected to immensely drive the copper wire bonding market in India through the forecast period.
Market Coverage :
• The market number available for – 2020-2027
• The base year – 2020
• The forecast period is from 2021 to 2027
• Segment Covered-
o By Type
o By Application
• Regions Covered
o North America
o Europe
o Asia-Pacific
o Rest of the Word
• Competitive Landscape: Freescale Semiconductor, Micron Technology, Cirrus Logic, Fairchild Semiconductor, Maxim, Integrated Silicon Solution.
Key questions addressed by the report
• What is the market growth rate?
• Which segment and region dominate the market in the base year?
• Which segment and region will project the fastest growth in the market?
• How has COVID-19 impacted the market?
o Deviation from the pre-COVID-19 forecast
o Most affected region and segment
• Who is the leader in the market?
• How players are addressing challenges to sustain growth?
• Where is the investment opportunity?
Global Copper Wire Bonding Market,
By Type
• 0-20 um
• 20-30 um
• 30-50 um
• Above 50 um
By Application
• Semiconductor Packaging
• PCB
• Others
This release has been published on OMR Industry Journal. OMR Industry Journal is not responsible for any content included in this release.
