The global copper wire bonding market is anticipated to grow at a significant CAGR during the forecast period. Copper wire bonding is a wire bonding procedure in semiconductor packaging that uses copper wire instead of aluminium or gold wires in standard semiconductor packaging. Copper wire bonding began to appear in low-cost consumer-grade in 2018, eventually replacing gold wire bonding due to lower cost optimization. The growing gold costs, as well as the rising adoption of copper wire bonding in the automotive and consumer electronics industries, are propelling the global copper wire bonding market.
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Copper wire bonding is also utilised in a variety of applications across many industry verticals, including healthcare, military and defence, consumer electronics, automotive, aviation, and a few others. This has resulted in growing demand from manufacturers, which is driving the global copper wire bonding market growth over the forecast period. Copper wire bonding is also used in harsh environment applications because of their superior electrical and thermal conductivity, which enhance performance.
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- Market Coverage
- Market number available for – 2024-2031
- Base year- 2024
- Forecast period- 2024-2031
- Segment Covered- By Source, By Product Type, By Applications
- Competitive Landscape- Archer Daniels Midland Co., Ingredion Inc., Kerry Group Plc, Cargill
- , and others
Global Copper Wire Bonding Market,
By Type
- 0-20 um
- 20-30 um
- 30-50 um
- Above 50 um
By Application
- Semiconductor Packaging
- PCB
- Others
Global Copper Wire Bonding Market by Region
North America
- US
- Canada
Europe
- UK
- Germany
- Italy
- Spain
- France
- Rest of Europe
Asia-Pacific
- China
- India
- Japan
- Rest of Asia-Pacific
Rest of the World
- Latin America
- Middle East & Africa
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