Die Bonder Equipment Market 2021 Size, Growth Analysis Report, Forecast to 2027

The global die bonder equipment market is expected to grow from USD 820 million in 2019 to USD 972 million with an annual growth rate of 3% through 2024. Key factors driving the growth of the Die Bonder Equipment market include increasing demand for small electronic components and increasing adoption of stackable die technology in IoT devices.

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Die Bonder Equipment Market Segmentation

By Type

• Manual Die Bonders
• Semiautomatic Die Bonders
• Fully Automatic Die Bonders

By Bonding Technique

• Epoxy
• Eutectic
• Soft Solder
• Others

By Supply Chain Participant:

• OSAT Companies
• IDM Firms

By Device:

• Optoelectronics
• MEMS And MOEMS
• Power Devices

By Application:

• Consumer Electronics
• Automotive
• Industrial
• Telecommunications
• Healthcare
• Aerospace & Defense

(This release has been published on OMR Industry Journal. OMR Industry Journal is not responsible for any content included in this release.)