The cold plate dissipates the heat generated by electronic components,or any other surface with high heat load,to the liquid flowing to the remote heat exchanger. Heat can be transferred to surrounding other liquids in secondary cooling system.While proper liquid cooling is necessary to transfer heat,air cooling is not sufficient while cooling Igbit modules or power electronics. The liquid cold plate provides 4 times better cooling as compared to that offered by an equal mass of air. The liquid cooling system consists of a pump,heat exchanger,connecting tube and cold plate, which can replace the space-consuming heat sink and fan.
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Market Segments
Company profiles
- BOYD Corporation
- Wieland Microcool
- Columbia-Staver Limited
- Telerex
- Parker Hannifin Corporation
- Sakura
- Sanhua
- Stulz GmbH
- Dana Limited
- Priatherm
- Cofan USA, Inc.
- CECLA Metal Process
By Coolanttype
- Water
- Deionized Water
- Inhibited Glycol and Water Solutions
- Dielectric Fluids
- Polyaphaolefin
- Others
By Tubing Type
- Copper
- Stainless Steel
- Others
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Scope of the Report
The research study analyzes the global Intravenous Equipment industry from 360-degree analysis of the market thoroughly delivering insights into the market for better business decisions, considering multiple aspects some of which are listed below as:
Recent Developments
o Market Overview and growth analysis
o Import and Export Overview
o Volume Analysis
o Current Market Trends and Future Outlook
o Market Opportunistic and Attractive Investment Segment
Geographic Coverage
o North America Market Size and/or Volume
o Latin America Market Size and/or Volume
o Europe Market Size and/or Volume
o Asia-pacific Market Size and/or Volume
o Rest of the world Market Size and/or Volume
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