The Global Interposer Fan Out Wlp Market size is expected to grow at an annual average of 26.3% during 2019-2025. An interposer is basically an electrical interface whose purpose is to reroute a connection to another connection. FOWLP (Fan-out WLP) is an advanced version of the standard wafer level package and is a technology developed to meet the demand for a higher level of integration and a larger number of external contacts by electrical devices.
The following players are covered in this report:
By Packaging Technology:
- Through-silicon vias (TSVs)
- Interposers
- Fan-out wafer-level packaging (FOWLP)
By Application:
- Logic
- Memory
- MEMS/sensors
- LED
By End-User Industry:
- Consumer electronics
- Telecommunication
- Industrial sector
Automotive
(This release has been published on OMR Industry Journal. OMR Industry Journal is not responsible for any content included in this release.)
