The Semiconductor Packaging Material Market size is expected to grow at an annual average of 5% during 2021-2027. Semiconductor packaging materials are used in the final stages of semiconductor device manufacturing and are used to protect devices from deterioration and external influences. Global semiconductor packaging materials have detected notable growth over the past few years as the demand for mobile phones, tablets and other communication devices increases.
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A full report of Semiconductor Packaging Material Market is available at: https://www.orionmarketreports.com/semiconductor-packaging-materials-market/37670/
The following segmentation are covered in this report:
By Packaging Technology:
- SOP
- GA
- QFN
- DFN
- QFP
- DIP
- Others
By Type:
- Organic substrates
- Bonding wires
- Leadframes
- Encapsulation resins
- Ceramic packages
- Die attach materials
- Thermal interface materials
- Solder balls
- Others
Company Profile
- Amkor Technology
- DuPont
- BASF
- Henkel
- Honeywell
- Kyocera
- Toppan Printing
- Hitachi Chemical
- ASM Pacific Technology
- Beijing Kehua New Chemical Technology
The report covers the following objectives:
- Proliferation and maturation of trade in the global Semiconductor Packaging Material Market
- The market share of the global Semiconductor Packaging Material Market supply and demand ratio, growth revenue, supply chain analysis, and business overview.
- Current and future market trends that are influencing the growth opportunities and growth rate of the Semiconductor Packaging Material Market
- Feasibility study, new market insights, company profiles, investment return, revenue (value), and consumption (volume) of the global Semiconductor Packaging Material Market
(This release has been published on OMR Industry Journal. OMR Industry Journal is not responsible for any content included in this release.)
