The global wireless connectivity IC market size is expected to grow from USD 69 billion in 2020 to USD 114.1 billion in 2025, growing at a CAGR of 15%. The key factors driving the growth of the wireless connectivity market are increasing trends such as increasing demand for wireless sensor networks in smart infrastructure development, significant increase in Internet penetration, increasing adoption of Internet of Things (IoT), and work. Growing demand for low-power wide area (LPWA) networks in home and virtual learning, IoT applications related to the COVID-19 pandemic. The high-power consumption of wireless sensors, terminals and connected devices and the lack of uniform communication standards limit the wireless connectivity market.
A full report of Wireless connectivity IC Market available at https://www.orionmarketreports.com/wireless-connectivity-ic-market/26338/
Top Companies in Wireless Connectivity IC Market: Cisco Systems, Texas Instruments, Toshiba Corporation, Qualcomm, NXP Semiconductor, Silicon labs, DNA technology, Maxim Integrated, MediaTek Inc, STMicroelectronics, Microchip, Renesas Electronics Corporation, and Cypress Semiconductor
Wireless connectivity IC Market: Segmentation
By Connectivity technology:
• Wi-Fi
• Bluetooth Classic
• Bluetooth 4X
• Bluetooth 5X
• ZigBee
• Z-Wave
• Thread
• NFC
• GNSS
• EnOcean
• Cellular M2M Technologies
• UWB
• LoRa
• SigFox
• NB-IoT
• LTE CATM1
• Others (N-Wave, Wi-SUN, Extended Coverage–GSM–Internet of Things (EC-GSM-IoT), Weightless, Ingenu, Qowisio, Wi-Fi HaLow, Wireless Highway Addressable Remote Transducer Protocol (WirelessHART), and Telensa)
By Type:
• WLAN
• WPAN
• Satellite
• LPWAN
• Cellular M2M
By End Use:
• Wearable Devices
• Healthcare
• Consumer Electronics
• Building Automation
• Automotive & Transportation
• Others (Agriculture, BFSI, Retail, Oil & Gas, Aerospace & Defense, and Industrial)
(This release has been published on OMR Industry Journal. OMR Industry Journal is not responsible for any content included in this release.)
