OSAT Market is thriving worldwide by 2029

Outsourced Semiconductor Assembly and Test Services (OSAT) market is anticipated to grow at a considerable CAGR of 8.4% during the forecast period. The increasing usage of OSAT in different industrial vertical is a key factor driving the growth of the global OSAT market. The considerable rise in the number of connected devices and consumer electronics, and the emphasis on quality improvement and end-to-end testing solutions by companies is a major motivator to the market growth. Additionally, the OSAT market is projected to benefit from the growing dominance of fabless market players in IC sales.

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Cohesive government policies are further contributing to the market growth. For instance, in May 2023, Indian government has announced its plan to approve the proposal by Micron Technology to set up an assembly, testing, marking and packaging (ATMP) facility in the country involving an investment of about $1 billion. India’s flagship $10 billion semiconductor scheme offers financial incentives to set up fab plants, ATMPs, outsourced semiconductor assembly and test (OSAT) units, and chip design facilities. The government offers 50.0% fiscal support for the capital expenditure to eligible companies setting up ATMPs or OSATs.

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  • Market Coverage
  • Market number available for – 2023-2029
  • Base year- 2022
  • Forecast period- 2023-2029
  • Segment Covered- By Source, By Product Type, By Applications
  • Competitive Landscape- Archer Daniels Midland Co., Ingredion Inc., Kerry Group Plc, Cargill
  • , and others

Market Segmentation

Global Outsourced Semiconductor Assembly and Test Services (OSAT) Market By Packaging Type 

  • Ball Grid Array (BGA) Packaging
  • Chip-scale Packaging (CSP)
  • Stacked Die Packaging
  • Multi-chip Packaging
  • Quad Flat and Dual-inline Packaging

Global Outsourced Semiconductor Assembly and Test Services (OSAT) Market by Service Type

  • Packaging
  • Testing

Global Outsourced Semiconductor Assembly and Test Services (OSAT) Market by Application

  • Communication
  • Consumer Electronics
  • Automotive
  • Computing & Networking
  • Industrial
  • Other

Regional Analysis

  • North America
  • United States
  • Canada
  • Europe
  • UK
  • Germany
  • Italy
  • Spain
  • France
  • Rest of Europe
  • Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Rest of Asia-Pacific
  • Rest of the World

Company Profiles 

  • Amkor Technology Inc.
  • ASE Group
  • Chipbond Technology Corp.
  • ChipMOS Technologies Inc.
  • Formosa Advanced Technologies Co. Ltd.
  • Hana Micron Inc.
  • Integrated Micro-electronics Inc.
  • Jiangsu Changjiang Electronics Technology Co. Ltd.
  • King Yuan Electronics Co. Ltd.
  • Lingsen Precision Industries Ltd.
  • Powertech Technology Inc.
  • Tianshui Huatian Technology Co. Ltd.
  • Tongfu Microelectronics Co.
  • UTAC Holdings Ltd.

The Report Covers

  • Market value data analysis of 2022 and forecast to 2030.
  • Annualized market revenues ($ million) for each market segment.
  • Country-wise analysis of major geographical regions.
  • Key companies operating in the global OSAT market. Based on the availability of data, information related to new product launches, and relevant news is also available in the report.
  • Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.
  • Analysis of market-entry and market expansion strategies.
  • Competitive strategies by identifying ‘who-stands-where’ in the market.

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