The Surface Mount Technology Market is expected to register a CAGR of 7.46% over the forecast period from 2021 to 2027.
There are numerous methods for attaching components to a PCB. Although through-hole methods were widely used in the past, surface mounted technology (SMT) offers significant advantages. In SMT, components are placed directly on the surface of a PCB to form a surface-mount device (SMD). SMT has largely replaced through-hole technology methods for manufacturing PCBs due to its effectiveness and efficiency. Both techniques, however, can be used on the same PCB. This is due to the fact that certain components are not suitable for surface mounting. Large transformers and heatsinked power semiconductors may be among these components. SMT components are smaller in size than through-hole units because they have smaller leads or no leads at all.
A full report of Surface Mount Technology Market available at: https://www.orionmarketreports.com/surface-mount-technology-market/31321/
Key market players in global surface mount technology are ASM Assembly Systems GmbH & Co. KG, CyberOptics®, FUJI MACHINE MFG. CO., LTD., Juki Corporation, Hitachi High Technologies Corporation, Nikon Metrology NV Tioga Limited, Allen Organ Company LLC., Omron Corporation and Panasonic Corporation. Key players are primarily focusing on research & development activity in order to develop innovative technology.
Surface Mount Technology Market- Segmentation
By Product Type
• SMT Pick and Place Equipment
• SMT Solder Paste Printer
• SMT Reflow Oven
• SMT Rework Station
By Application
• Automotive
• Consumer Electronics
• Telecommunication
• Medical
(This release has been published on OMR Industry Journal. OMR Industry Journal is not responsible for any content included in this release.)
