An increased demand for 3D semiconductor packaging in microelectronic devices drives the growth in the 3D semiconductor packaging industry.The growing adoption of advanced packaging technology with improved efficiency, and less power consumption is the key factor supporting the growth of the market globally. The market players are also focusing on introducing 3D semiconductor packaging solutions that further bolster the market growth. For instance, in November 2023, Amkor Technology, Inc., a provider of semiconductor packaging and test services, announced to building of an advanced packaging and test facility in Peoria, Arizona. By the time of full project completion, Amkor projects to invest approximately $2 billion and employ approximately 2,000 people at the new facility.
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The global 3D semiconductor packaging market is segmented on the technology, material, and industry verticals. Based on the technology, the market is sub-segmented into 3D through silicon via, 3D package on package, 3D fan out based and 3D wire bonded. Based on the material, the market is sub-segmented into organic substrate, bonding wire, leadframe, encapsulation resin and ceramic package. Further, on the basis of industry verticals, the market is sub-segmented into electronics, industrial, automotive & transport, healthcare, IT & telecommunication and aerospace & defense. Among the industry vertical, the electronics sub-segment is anticipated to hold a considerable share of the market owing to the rise in the development of 3D packaging integration to the next level by stacking multiple semiconductor dies on top of each other.
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- Market Coverage
- Market number available for – 2024-2031
- Base year- 2024
- Forecast period- 2024-2031
- Segment Covered- By Source, By Product Type, By Applications
- Competitive Landscape- Archer Daniels Midland Co., Ingredion Inc., Kerry Group Plc, Cargill
- , and others
Market Segmentation
Global 3D Semiconductor Packaging Market by Technology
- 3D Through silicon via
- 3D Package on Package
- 3D Fan Out Based
- 3D Wire Bonded
Global 3D Semiconductor Packaging Market by Material
- Organic Substrate
- Bonding Wire
- Leadframe
- Encapsulation Resin
- Ceramic Package
Global 3D Semiconductor Packaging Market by Industry Vertical
- Electronics
- Industrial
- Automotive & Transport
- Healthcare
- IT & Telecommunication
- Aerospace & Defense
Regional Analysis
- North America
- United States
- Canada
- Europe
- UK
- Germany
- Italy
- Spain
- France
- Rest of Europe
- Asia-Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
- Rest of the World
Company Profiles
- Amkor Technology
- Analog Devices, Inc.
- Cadence Design Systems, Inc.
- GlobalFoundries
- Indium Corp.
- Micron Technology, Inc.
- NVIDIA Corp.
- Qualcomm Technologies, Inc.
- Semiconductor Components Industries, LLC
- Siliconware Precision Industries Co., Ltd.
- SK HYNIX INC.
- STMicroelectronics
- Taiwan Semiconductor Manufacturing Company Ltd.
- TEKTRONIX, INC.
- Texas Instruments Inc.
- Thermo Fisher Scientific Inc.
- Tower Semiconductor
- United Microelectronics Corp.
The Report Covers
- Market value data analysis of 2023 and forecast to 2031.
- Annualized market revenues ($ million) for each market segment.
- Country-wise analysis of major geographical regions.
- Key companies operating in the global 3D semiconductor packaging market. Based on the availability of data, information related to new product launches, and relevant news is also available in the report.
- Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.
- Analysis of market-entry and market expansion strategies.
- Competitive strategies by identifying ‘who-stands-where’ in the market.
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